Emerald

Soldering & Surface Mount Technology

(ISSN 1758-6836)

Aims & scope

Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International.

The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches.

Among the range of topics covered are:

• Soldering science and technology

• Novel soldering processes and new solder alloys

• Surface mount technology (SMT)

• Surface mount assembly

• Advanced packaging technologies and 3D interconnects

• Flip chip/BGA/SiP/TSV

• Novel substrates and embedded components

• Solderable finishes and coatings

• Screen printing

• Conductive adhesives and conformal coatings

• Reliability

• Quality control

• Inspection and testing

• Rework and repair

• Environmental aspects